Electronic device having biometric sensors and light emitting units

ABSTRACT

An electronic device includes a plurality of light emitting units, a plurality of sensing units, and a sensor driving unit. The plurality of light emitting units are disposed on a first substrate. The plurality of sensing units correspond to the plurality of light emitting units, and the plurality of light emitting units and the plurality of sensing units are disposed in a same region. The sensor driving unit is coupled to at least a portion of the plurality of sensing units, and the plurality of light emitting units and the sensor driving unit are partially overlapped with each other.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser.No. 17/399,066, filed on Aug. 11, 2021, which is a continuationapplication of U.S. application Ser. No. 16/371,149, filed on Apr. 1,2019. The contents of these applications are incorporated herein byreference.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The disclosure relates to touchscreen devices, and specifically, to anelectronic device having biometric sensors and light emitting units.

2. Description of the Prior Art

The growing demand for information security and information privacy hasdriven use of biometric authentication on electronic devices such assmartphones, laptops, tablets, banking devices, and gaming consoles. Apopular form of biometric authentication is fingerprint identification.Recently, fingerprint sensors have been adopted by various electronicdevices so that the electronic devices can be unlocked by device ownersvia fingerprint authentication, protecting the electronic devices fromunauthorized access.

Conventionally, a fingerprint sensor is provided separately from adisplay screen on a display device, so a screen-locked display devicecan be unlocked by simply touching the fingerprint sensor. Nevertheless,it is of great interest to display device manufacturers and users tocombine a fingerprint sensor into a display screen, thereby increasing adisplay region of a display device and offering a narrow-frame orframe-less design of non-display region of the display device.

Therefore, a need has arisen for a display device to incorporatebiometric sensors, reducing the size of a frame of the display devicewhile providing biometric authentication to protect against unauthorizedaccess to the display device.

SUMMARY OF THE DISCLOSURE

The embodiment provides an electronic device including a plurality oflight emitting units, a plurality of sensing units, and a sensor drivingunit. The plurality of light emitting units are disposed on a firstsubstrate. The plurality of sensing units correspond to the plurality oflight emitting units, and the plurality of light emitting units and theplurality of sensing units are disposed in a same region. The sensordriving unit is coupled to at least a portion of the plurality ofsensing units, and the plurality of light emitting units and the sensordriving unit are partially overlapped with each other.

These and other objectives of the present disclosure will no doubtbecome obvious to those of ordinary skill in the art after reading thefollowing detailed description of the embodiment that is illustrated inthe various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a display device according to an embodimentof the disclosure.

FIG. 2 shows a top view of an exemplary circuit layout of the displaydevice in FIG. 1 .

FIG. 3 shows a cross-sectional view of the circuit layout of the displaydevice in FIG. 2 along line 3-3′.

FIG. 4 shows a top view of another exemplary circuit layout of thedisplay device in FIG. 1 .

FIG. 5 shows a top view of another exemplary circuit layout of thedisplay device in FIG. 1 .

FIG. 6 shows a top view of another exemplary circuit layout of thedisplay device in FIG. 1 .

FIG. 7 shows a cross-sectional view of the circuit layout of the displaydevice in FIG. 6 along line 7-7′.

FIG. 8 shows another cross-sectional view of the circuit layout of thedisplay device in FIG. 6 along line 8-8′.

FIG. 9 is a circuit schematic of a gate driver according to anembodiment of the disclosure.

FIG. 10 shows a top view of overlapping transistors in another exemplarycircuit layout of the display device in FIG. 1 .

FIG. 11 shows a cross-sectional view of the circuit layout of thedisplay device in FIG. 10 along line 11-11′.

FIG. 12 shows a top view of overlapping transistors on another exemplarycircuit layout of the display device in FIG. 1 .

FIG. 13 shows a cross-sectional view of the circuit layout of thedisplay device in FIG. 12 along line 13-13′.

FIG. 14 shows a cross-sectional view of selected devices of the displaydevice in FIG. 1 .

FIGS. 15 to 17 show three cross-sectional views of exemplary circuitlayouts of the display device in FIG. 1 .

DETAILED DESCRIPTION

The following embodiments when read with the accompanying drawings aremade to clearly exhibit the above-mentioned and other technicalcontents, features and effects of the present disclosure. Through theexposition by means of the specific embodiments, people would furtherunderstand the technical means and effects of the present disclosure toachieve the above-indicated objectives. Moreover, as the contentsdisclosed herein should be readily understood and can be implemented bya person skilled in the art, all equivalent changes or modificationswhich do not depart from the concept of the present disclosure should beencompassed by the appended claims.

Furthermore, the ordinals recited in the specification and the claimssuch as “first”, “second” to “sixth” and so on are intended only todescribe the elements claimed and imply or represent neither that theclaimed elements have any proceeding ordinals, nor that sequence betweenone claimed element and another claimed element or between steps of amanufacturing method. The use of these ordinals is merely todifferentiate one claimed element having a certain designation fromanother claimed element having the same designation. It will beunderstood that when an element or layer is referred to as being“disposed on” another element or layer, it can be directly disposed onthe other element or layer, or intervening elements or layers may bepresent. In contrast, when an element is referred to as being “directlydisposed on” another element or layer, there are no intervening elementsor layers exist. As used herein, the term “coupled to” is equivalent to“electrically connected” in the disclosure.

FIG. 1 is a block diagram of a display device 1 according to anembodiment of the disclosure. The display device 1 has a display region10 and a side region 12 adjacent to the display region 10. The displaydevice 1 has biometric sensors which combines functions of imagedisplaying and image sensing on the display region 10. In oneembodiment, The display device 1 can also be a liquid-crystal display(LCD) device, an organic light-emitting diode (OLED) display device, aninorganic LED mini-LED display device (ex. A mini-LED panel device, amicro-LED panel device, or a quantum dot LED panel device), but it isnot limited thereto. In another embodiment, a shape of the displayregion 10 or the display device 1 could be a rectangle, a square, acircular, or a free form, but it is not limited thereto. The displayregion 10 may be a display screen area of the display device 1 and theside region 12 may be at least one portion of a non-display regionoutside the display region 10. Specifically, the display device 1comprises a plurality of display units 100, a plurality of displaydriving units 102, a plurality of sensing units 104 and a plurality ofsensor driving units 106 disposed in the display region 10, and adisplay gate driver 120, a sensor gate driver 122, a display data driver124, a sensor data driver 126, and a control circuit 128 disposed in theside region 12.

The plurality of display driving units 102 may be thin-film transistorsfor respectively driving the plurality of display units 100 to displayan image on the display region 10. The plurality of sensor driving units106 may be thin-film transistors for respectively driving the pluralityof sensing units 104 to detect an image such as a fingerprint. In oneembodiment, at least one of the thin-film transistors comprises anamorphous thin-film transistor, a low-temperature polysilicon thin-filmtransistor, or a metal-oxide thin-film transistor, but it is not limitedthereto. The display gate driver 120 may be coupled to a portion of theplurality of display units 100 and may comprise a plurality of firstthin-film transistors to select display units 100 via correspondingdisplay driving units 102, and the display data driver 124 may becoupled to the portion of the plurality of display units 100 and maycomprise multiplexers or switches to load image data to the selecteddisplay units 100. Similarly, the sensor gate driver 122 may be coupledto a portion of the plurality of sensing units 104 and may comprise aplurality of second thin-film transistors to select sensing units 104via corresponding sensor driving units 106, and the sensor data driver126 may be coupled to a portion of the plurality of sensing units 104and may comprise multiplexers or switches to read detected signals fromthe selected sensing units 104. The control circuit 128 may be an imageprocessor, a digital signal processor, a central processing unit or amicroprocessor. The control circuit 128 may be coupled to the displaygate driver 120, the sensor gate driver 122, the display data driver124, and the sensor data driver 126 to control the plurality of displayunits 100 and the plurality of sensing units 104. At least a portion ofthe plurality of first thin-film transistors and at least a portion ofthe plurality of second thin-film transistors are disposed in the sideregion 12.

As used herein, a display driver may refer to the display gate driver120 or the display data driver 124, and a sensor driver may refer to thesensor gate driver 122 or the sensor data driver 126. Variousembodiments of circuit layouts of the display device 1 are provided inFIGS. 2 through 5 and 7 through 10 to illustrate how the display driverand the sensor driver can share the side region 12 efficiently whiledelivering desired signal quality.

FIG. 2 shows a top view of an exemplary circuit layout of the displaydevice 1, FIG. 3 shows a cross-sectional view of the circuit layout ofthe display device 1 along line 3-3′. FIG. 2 shows that the displaydevice 1 further comprises an array substrate 14. The display datadriver 124, the sensor data driver 126 and the control circuit 128 sharethe side region 12. The side region 12 is one portion of a non-displayregion surrounding the display region 10, for example, the portion isdisposed adjacent to a bottom side 11 of the display region 10. Thesensor data driver 126 is disposed on the display data driver 124 fromthe top view direction of the display device 1. FIG. 3 shows that thedisplay device 1 further comprises a first insulating layer 32 and asecond insulating layer 30 sequentially disposed on the array substrate14. The cross-sectional view in FIG. 3 also shows that the sensor datadriver 126 and the display data driver 124 are disposed on the arraysubstrate 14 and are at least partially overlapping with each other fromthe top view direction of the display device 1. The first insulatinglayer 32 and the second insulating layer 30 may comprise siliconnitrides (SiNx), silicon oxides (SiOx), or a combination thereof, andmay have a plurality of layers.

In FIG. 2 , the top view shows that display sub-pixels Pd(1,1), Pd(1,2),Pd(1,3), Pd(2,1), Pd(2,2), Pd(2,3) and sensor pixels Ps(1,1), Ps(1,2),Ps(2,1), Ps(2,2) may be arranged in a matrix form, a free form (notshown), or combination thereto in the display region 10. Each of thedisplay sub-pixels Pd(M,N) may comprise a display unit 100 and a displaydriving unit 102, and may be one of red, green and blue (RGB)sub-pixels, where M and N are positive integers and respectivelyrepresent row and column indexes of the matrix of display sub-pixels.Specifically, the RGB sub-pixels may be arranged according to a fixedalternate sub-pixel layout. The control circuit 128 and the display datadriver 124 may be coupled to display sub-pixels Pd(1,1), Pd(2,1) in afirst column via a display data line Ldd[1], to display sub-pixelsPd(1,2), Pd(2,2) in a second column via a display data line Ldd[2], andto display sub-pixels Pd(1,3), Pd(2,3) in a third column via a displaydata line Ldd[3]. Likewise, each of the sensor pixels Ps(P,Q) maycomprise a sensing unit 104 and a sensor driving unit 106, and P and Qare positive integers and respectively represent row and column indexesof the matrix of sensor sub-pixels. The control circuit 128 and thesensor data driver 126 may be coupled to sensor pixels Ps(1,1), Ps(2,1)in a first column via a sensor data line Lsd[1], and to sensor pixelsPs(1,2), Ps(2,2) in a second column via a sensor data line Lsd[2]. Thedisplay sub-pixels Pd(M,N) and the sensor pixels Ps(P,Q) may be arrangedalternately along each row of the matrix, but it is not limited thereto.

The overlapping configuration of the sensor data driver 126 and thedisplay data driver 124 leads to a reduction in the area of the sideregion 12, thereby shrinking the size of the display device 1. Note thatthe circuit layout of the display device 1 is not limited to theoverlapping configuration as shown in FIGS. 2 and 3 , but the sensordata driver 126 and the display data driver 124 may also be notoverlapping with each other from the top view direction of the displaydevice 1. The top view direction is the direction of observation in FIG.2 . Moreover, the sensor data driver 126 and the display data driver 124may be disposed between the display region 10 and the control circuit128 from the top view direction of the display device 1. The displaydata driver 124 and the sensor data driver 126 other than a data lineswitching circuit and a readout switching circuit may be integrated withthe control circuit 128 into an integrated circuit. The data lineswitching circuit of the display data driver 124 and the readoutswitching circuit of the sensor data driver 126 may be disposed ondisplay region 10. Further note that the number of the displaysub-pixels Pd(M,N) and the number of the sensor pixels Ps(P,Q) are notlimited to those provided in FIGS. 2 and 3 , any number of the displaysub-pixels Pd(M,N) and the sensor pixels Ps(P,Q) may be adopted in thedisplay device 1, and the dimension of the matrix of the displaysub-pixels Pd(M,N) may be the same as or different from that of thesensor pixels Ps(P,Q).

FIGS. 4 and 5 show top views of two exemplary circuit layouts of thedisplay device 1, where the display gate driver 120 and the sensor gatedriver 122 share the side region 12 and are not overlapping with eachother, and the side region 12 is disposed on one side (for example, leftside) of the display device 1. The internal circuit configuration ofdisplay sub-pixels Pd(M,N) and sensor pixels Ps(P,Q) are similar to thatin FIG. 2 , and the detailed explanation therefor is omitted here forsimplicity. A top view plane of the display device 1 has an x-direction(ex: first direction) and a y-direction (ex: second direction)perpendicular thereto. The top view plane is the plane of observation inFIG. 4 or 5 .

In FIG. 4 , the display gate driver 120 and the sensor gate driver 122are disposed along the y-direction. The display gate driver 120 may becoupled to display sub-pixels Pd(M,N) in a first row via a display gateline Ldr[1] and to display sub-pixels Pd(M,N) in a second row via adisplay gate line Ldr[2]. Likewise, the sensor gate driver 122 may becoupled to sensor pixels Ps(P,Q) in a first row via a sensor gate lineLsr[1] and to sensor pixels Ps(P,Q) in a second row via a sensor gateline Lsr[2]. The control circuit 128 is coupled to the display gatedriver 120 and the sensor gate driver 122 via connecting members 400,401, 420, 421 to select each row of the display sub-pixels Pd(M,N) andeach row of the sensor pixels Ps(P,Q), respectively. In FIG. 5 , thedisplay gate driver 120 and the sensor gate driver 122 are respectivelygrouped into display sub-gate drivers 120 a, 120 b and sensor sub-gatedrivers 122 a, 122 b, and the display sub-gate drivers 120 a, 120 b andthe sensor sub-gate drivers 122 a, 122 b are arranged alternately andaligned along the y-direction. The display sub-gate drivers 120 a, 120 band the sensor sub-gate drivers 122 a, 122 b may be arranged alternatelyin unequal quantities. For example, 3 sub-gate drivers 120 a and 2sensor sub-gate drivers 122 a may be arranged alternately, and 3sub-gate drivers 120 b and 2 sensor sub-gate drivers 122 b may bearranged alternately. The display sub-gate driver 120 a may be coupledto display sub-pixels Pd(M,N) in a first row via a display gate lineLdr[1] and the display sub-gate driver 120 b may be coupled to displaysub-pixels Pd(M,N) in a second row via a display gate line Ldr[2].Likewise, the sensor sub-gate driver 122 a may be coupled to sensorpixels Ps(P,Q) in a first row via a sensor gate line Lsr[1] and thesensor sub-gate driver 122 b may be coupled to sensor pixels Ps(P,Q) ina second row via a sensor gate line Lsr[2]. The control circuit 128 isrespectively coupled to the display sub-gate drivers 120 a, 120 b andthe sensor sub-gate drivers 122 a, 122 b via connecting members 500,501, 520, 521 to select each row of the display sub-pixels Pd(M,N) andeach row of the sensor pixels Ps(P,Q).

The circuit layouts of the sensor data driver 126 and the display datadriver 124 as in FIGS. 4 and 5 provides a narrow-frame design (smallernon-display region or side region 12) for the display device 1. Notethat the circuit layout of the display device 1 is not limited to thosein FIGS. 4 and 5 , but the display gate driver 120 and the sensor gatedriver 122 may also be arranged into a stacked configuration. Inaddition, the side region 12 may be split into first and second sidesub-regions arranged at opposite sides of the display region 10, and thedisplay gate driver 120 and the sensor gate driver 122 may berespectively split into two parts, so that first parts of the displaygate driver 120 and the sensor gate driver 122 may be disposed in thefirst side sub-region to control scan data of one half of the displayunits 100 and the sensing units 104, and second parts of the displaygate driver 120 and the sensor gate driver 122 may be disposed in thesecond side sub-region to control scan data of the other half of thedisplay units 100 and the sensing units 104. The circuit layout of thesplit parts of the display gate driver 120 and the sensor gate driver122 in either side sub-region may be arranged in any layout form asdiscussed in FIGS. 4 and 5 . Moreover, the display data driver 124 andthe sensor data driver 126 other than a data line switching circuit anda readout switching circuit may be integrated with the control circuit128 into an integrated circuit. The data line switching circuit of thedisplay data driver 124 and the readout switching circuit of the sensordata driver 126 may be disposed on display region 10. Further note thatthe number of display sub-pixels Pd(M,N) and the number of sensor pixelsPs(P,Q) are not limited to those provided in FIGS. 4 and 5 , any numberof display sub-pixels Pd(M,N) and sensor pixels Ps(P,Q) may be adoptedin the display device 1, and the dimension of the matrix of the displaysub-pixels Pd(M,N) may be the same as or different from that of thesensor pixels Ps(P,Q). Any combination of the circuit layouts of thedisplay gate driver 120, the sensor gate driver 122, the display datadriver 124, and the sensor data driver 126 as disclosed in FIGS. 2through 5 may be adopted in the display device 1.

FIG. 6 shows a top view of another exemplary circuit layout of thedisplay device 1, FIG. 7 shows a cross-sectional view of the circuitlayout of the display device 1 in FIG. 6 along line 7-7′, and FIG. 8shows another cross-sectional view of the circuit layout of the displaydevice 1 in FIG. 6 along line 8-8′. Side sub-regions 12 a and 12 b arealigned along the x-direction and at opposite sides of the displayregion 10, and a side sub-region 12 c and the display region 10 arealigned along the y-direction. In FIG. 6 , the display gate driver 120 aand the sensor gate driver 122 a are overlapping with each other in theside sub-region 12 a, the display gate driver 120 b and the sensor gatedriver 122 b are overlapping with each other in the side sub-region 12b. The display data driver 124, the sensor data driver 126 and thecontrol circuit 128 are integrated into an integrated circuit 628disposed in the side sub-region 12 c. The integrated circuit 628 iscoupled to display sub-pixels Pd(1,1), Pd(2,1) via a display data lineLdd[1], display sub-pixels Pd(1,2), Pd(2,2) via a display data lineLdd[2] and display sub-pixels Pd(1,3), Pd(2,3) via a display data lineLdd[3]. Further, the integrated circuit 628 is coupled to sensorsub-pixels Ps(1,1), Ps(2,1) via a sensor data line Lsd[1] and sensorsub-pixels Pd(1,2), Ps(2,2) via a sensor data line Lsd[2]. The internalcircuit configuration of display sub-pixels Pd(M,N) and sensor pixelsPs(P,Q) are similar to that in FIG. 2 , and the detailed explanationtherefor is omitted here for simplicity.

The overlapping circuit layout, despite being compact in size, can causeinterference and degrade signal quality when the overlapping circuitswitches between states. As indicated in FIG. 7 , in order to reduceinterference, shielding layers 71 a, 71 b and/or insulating layers 72,74, 76 are provided between the overlapping display gate driver 120 aand sensor gate driver 122 a, and between the overlapping display gatedriver 120 b and sensor gate driver 122 b. The insulating layers 76, 74,72 may be sequentially disposed on a substrate 70, and may comprise anorganic material, an inorganic material or a combination thereof. Theshielding layer 71 a is disposed between at least a portion of theplurality of first thin-film transistors in the display gate driver 120a and at least a portion of the plurality of second thin-filmtransistors in the sensor gate driver 122 a. Similarly, the shieldinglayer 71 b is disposed between at least a portion of the plurality offirst thin-film transistors in the display gate driver 120 b and atleast a portion of the plurality of second thin-film transistors in thesensor gate driver 122 b. Specifically, the shielding layers 71 a, 71 bmay extend throughout an area between the at least the portion of theplurality of first thin-film transistors in the display gate drivers 120a, 120 b and the at least the portion of the plurality of secondthin-film transistors in the sensor gate drivers 122 a, 122 b,respectively. Further, the shielding layers 71 a, 71 b may beoverlapping with the display gate drivers 120 a, 120 b and the sensorgate drivers 122 a, 122 b in the z-direction in FIG. 7 . In otherembodiments, the shielding layers 71 a, 71 b may be disposed betweeneach of the at least the portion of the plurality of first thin-filmtransistors and its corresponding second thin-film transistor. In yetother embodiments, the shielding layer 71 a, 71 b may be disposedbetween channel regions of the at least the portion of the plurality offirst thin-film transistors and channel regions of the at least theportion of the plurality of second thin-film transistors. In FIG. 8 ,the display device 1 may further comprises an anisotropic conductivefilm (ACF) film 80, a first insulating layer 81, a second insulatinglayer 83 and connecting members 85. The second insulating layer 83, thefirst insulating layer 81, the ACF film 80 and the integrated circuit628 may be sequentially disposed on the substrate 70. The firstinsulating layer 81 and the second insulating layer 83 may comprisesilicon nitrides (SiNx), silicon oxides (SiOx), or a combinationthereof, and may have a plurality of layers.

The display data lines Ldd[1], Ldd[2], Ldd[3] and the sensor data lineLsd[1], Lsd[2] pass through different layers and then are coupled to theintegrated circuit 628 via connecting members 85 in vias, contact pads82 and ACF particles 84. The contact pads 82 comprise a metal materialsuch as copper, tungsten, silver, tin, nickel, chromium, titanium, lead,gold, bismuth, antimony, zinc, zirconium, magnesium, indium, tellurium,gallium, another suitable metal material, an alloy or a combinationthereof, and is not limited thereto. Each of the ACF particles 84comprise a core and a shell, with the core being formed bymacromolecules, and the shell formed by a metal or a metal alloy. Thematerial of the shell may be the same as that of the contact pads 82.

FIG. 9 is a circuit schematic of a gate driver 9 according to anembodiment of the disclosure. The gate driver 9 may serve as the displaygate driver 120 or the sensor gate driver 122, may generate a gate linesignal for a present row of display units 100 or sensing units 102, andmay comprise transistors M1 through M4 and a capacitor Cc. Signals STV,CKV, GL1, GL2, and VGL are a gate line signal for the preceding row, aclock signal, a gate line signal for the present row, a gate line signalof the succeeding row, and a ground reference signal, respectively. Thesource or drain of the transistor M1 is coupled to the gate of thetransistor M2 via a node Q(1). Upon the transistor M1 receiving a highvoltage level of the signal STV, the node Q(1) is pre-charged to a highvoltage level. Subsequently, the transistor M2 is turned on to pull thesignal GL1 to a high voltage level when the signal CKV switches to ahigh state, while boosting the voltage at the node Q(1) to a highervoltage Vh via the capacitor Cc. The high voltage level of the signalGL1 is passed to the next gate driver 9 for the succeeding row to pullthe signal GL2 to the high voltage level. Upon detecting the highvoltage level of the signal GL2, the transistors M3 and M4 are turned onto pull the voltage at the node Q(1) and the voltage of the signal GL1to a low voltage level, thereby completing generation of a pulse for thesignal GL1. The signal GL1 may be used to select the present row ofdisplay units 100 or sensing units 102.

FIGS. 10 and 12 show top views of overlapping transistors on otherexemplary circuit layouts of the display device 1, FIG. 11 shows across-sectional view of the circuit layout of the display device in FIG.10 along line 11-11′, and FIG. 13 shows a cross-sectional view of thecircuit layout of the display device in FIG. 12 along line 13-13′. FIGS.10 and 11 illustrate that a shielding layer 110 is present betweenoverlapping circuits, and FIGS. 12 and 13 illustrate that overlappingcircuits are slightly shifted from each other and no shielding layer isrequired between the overlapping circuits.

In FIG. 10 , the shielding layer 110 is inserted between the displaygate driver 120 and the sensor gate driver 122, and the display gatedriver 120 comprises two transistors 114 a, 114 b and the sensor gatedriver 122 comprises two transistors 112 a, 112 b.

In FIG. 11 , the transistor 112 a is disposed on the transistor 114 a,and a shielding pattern 110 a is disposed directed between a channelregion 1120 a of the transistor 112 a and a channel region 1140 a of thetransistor 114 a to shield undesired signal coupling between thetransistor 112 a and the transistor 114 a. The transistor 112 b isdisposed on the transistor 114 b, and a shielding pattern 110 b isdisposed directed between a channel region 1120 b of the transistor 112b and a channel region 1140 b of the transistor 114 b to shieldundesired signal coupling between the transistor 112 b and thetransistor 114 b. The channel regions of all transistors of the sensorgate driver 122 form a first channel layer, and the channel regions ofall transistors of the display gate driver 120 form a second channellayer. Further, all shielding patterns 110 a/110 b between the channelregions of the sensor gate driver 122 and the channel regions of thedisplay gate driver 120 form the shielding layer 110. The transistor 112a comprises a source 1122 a, a drain 1122 b, a gate 1128 a, and thechannel region 1120 a. The transistor 112 b comprises a source 1122 c, adrain 1122 d, a gate 1128 b, and the channel region 1120 b. The drain1122 b is coupled to the source 1122 c via a connecting member 1124. Theconnecting member 1124 may comprise aluminum, copper, indium tin oxide(ITO), titanium, or a combination thereof. The transistor 114 acomprises a source 1142 a, a drain 1142 b, a gate 1148 a, the channelregion 1140 a, and a light shielding layer 119 a. The transistor 114 bcomprises a source 1142 c, a drain 1142 d, a gate 1148 b, the channelregion 1140 b, and a light shielding layer 119 b. The drain 1142 b iscoupled to the source 1142 c via a connecting member 1144. Theconnecting member 1144 may comprise aluminum, copper, ITO, titanium, ora combination thereof. The display device 1 further comprises asequentially disposed substrate 1160, buffer layer 1162, firstinsulating layer 1164, first gate insulation layer 1166, firstinter-layer dielectric 1168, second inter-layer dielectric 1170, secondinsulating layer 1172, second gate insulation layer 1174, thirdinter-layer dielectric 1176, fourth inter-layer dielectric 1178 andthird insulating layer 1180. The third insulating layer 1180 maycomprise an organic material.

In FIG. 12 , the four transistors 112 a, 112 b, 112 c, 112 d of thesensor gate driver 122 are shifted away from four transistors 114 a, 114b, 114 c, 114 d of the display gate driver 120. Accordingly, thetransistors 112 a, 112 b, 114 a, 114 b and the display device 1 in FIG.13 have similar structures to those in FIG. 11 , except that thetransistors 112 a, 112 b are shifted from the transistors 114 a, 114 brespectively in FIG. 13 , and therefore, signal switching of thetransistors 112 a, 112 b and the transistors 114 a, 114 b will not causeinterference to each other, therefore no shielding layer is required.

FIG. 14 shows a cross-sectional view of selected devices of the displaydevice 1, depicting the display region 10 and the side region 12. In thedisplay region 10, a display unit 100, display driving units 102 a, 102b, a sensing unit 104 and a sensor driving unit 106 are provided. In theside region 12, a display data driver 124 and a sensor data driver 126are provided. A third channel layer of the display driving unit 102 a or102 b and at least one of a first channel layer in the display datadriver 124 and a second channel layer in the sensor data driver 126 areformed in a same process, thereby simplifying the manufacturing processand reducing manufacturing costs. For example, the material of the thirdchannel layer of the display driving unit 102 a or 102 b comprisesindium gallium zinc oxide (IGZO), low-temperature polycrystallinesilicon (LTPS), or combination thereof. The material of the firstchannel layer in the display data driver 124 comprises LTPS. Thematerial of the second channel layer in the sensor data driver 126comprises IGZO. The display device 1 comprises a substrate 1400, abuffer layer 1402, a first gate insulator 1404, an inter-layerdielectric 1406, a first back passivation layer 1408, a second gateinsulator 1410, a second back passivation layer 1412, a planarizationlayer 1414, a pixel defining layer 1416, a cathode layer 1418, aninorganic layer 1419, an organic layer 1420, an inorganic layer 1421, anN+ doped layer 1422, a P doped layer 1424, a second gate electrode 1426,a second semiconductor layer 1428, a source/drain member 1430, a lightshielding layer 1432, a semiconductor layer 1434, a second source/drainmember 1436, a gate electrode 1438, an anode layer 1440 and an organiclight-emitting diode (OLED) layer 1442.

FIGS. 15 through 17 show three cross-sectional views of exemplarycircuit layouts of the display device 1, illustrating three cases ofcircuit layouts in relation to thin-film transistor array substrates. InFIG. 15 , the plurality of display units 100, the plurality of sensingunits 104, the display drivers 120 a, 120 b and the sensor drivers 122a, 122 b are arranged on a first array substrate Sa and between thefirst array substrate Sa and a second substrate Sb. In FIG. 16 , theplurality of sensing units 104 and the plurality of display units 100are disposed on an array substrate Sa, and the display drivers 120 a,120 b and the sensor drivers 122 a, 122 b are respectively disposed onthe array substrate Sa. In FIG. 17 , the plurality of sensing units 104are disposed on the plurality of display units 100, and the sensordrivers 122 a, 122 b are disposed on the display drivers 120 a, 120 b,and the plurality of display units 100, the plurality of sensing units104, the display drivers 120 a, 120 b and the sensor drivers 122 a, 122b are arranged between two substrates Sa, Sb.

Various circuit configurations of display device 1 in FIGS. 2 through 8and 10 through 17 allow a biometric sensor to be integrated into adisplay panel of a display device, increasing a display region of adisplay device or reducing the size of a frame of the display devicewhile providing biometric authentication.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the disclosure. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. An electronic device comprising: a plurality oflight emitting units disposed on a first substrate; a plurality ofsensing units corresponding to the plurality of light emitting units,wherein the plurality of light emitting units and the plurality ofsensing units are disposed in a same region; and a sensor driving unitcoupled to at least a portion of the plurality of sensing units, whereinthe plurality of light emitting units and the sensor driving unit arepartially overlapped with each other.
 2. The electronic device of claim1, wherein one of the plurality of light emitting units overlaps atleast one sensing unit of the plurality of sensing units.
 3. Theelectronic device of claim 1, further comprising a light emittingdriving unit coupled to at least a portion of the plurality of lightemitting units.
 4. The electronic device of claim 3, wherein the sensordriving unit and the light emitting driving unit are at least partiallyoverlapping with each other.
 5. The electronic device of claim 3,wherein the plurality of sensing units and the light emitting drivingunit are at least partially overlapping with each other.
 6. Theelectronic device of claim 1, wherein the plurality of light emittingunits comprises an organic material.
 7. The electronic device of claim1, wherein the plurality of sensing units are configured to detect alight.
 8. The electronic device of claim 1, wherein the plurality ofsensing units are disposed on a second substrate.
 9. The electronicdevice of claim 8, wherein the plurality of sensing units are arrangedbetween the first substrate and the second substrate.